SILICON ON INSULATOR (SOI) PLATFORM

SiPhotonIC has developed 220SOI and 250SOI platforms, both optimized for operation at 1550nm and 1300nm for all compatible photonic applications.
The technology comprises well-characterized and ready-to-use libraries of building blocks that offer a great base to designers to launch their PIC development right with minimum effort and great flexibility.

The process is supported by a complete Process Design Kit (PDK) under the xPDK format available for both proprietary and open-source suites (Luceda, Synopsys, KLayout, GDS Factory, NAZCA, L-edit, GdsPy).
The xPDK package includes the necessary material to launch the tape out right away (i.e. design manuals, DRC rules & decks and reference designs) and can be obtained after registering and signing an NDA.

The SOI nano-fabrication service is available both as on-demand service and through scheduled MPW runs. We support a wide range of production volumes, from small quantities of PICs to full wafer batches.

To obtain the PDK and relevant design material, register through “ACCESS“.

 

STANDARD SOI PROCESS

The standard 220SOI and 250SOI PDK libraries offer a variety of building blocks to use for passive operation with thermo-optic phase shifting elements. The PDK libraries include full set of photonic components to launch your IC design and enhance them with your components:

      • Spot size converters
      • Vertical grating couplers (focusing and long taper)
      • Vertical 2D grating couplers for polarization splitting
      • Crosses
      • Directional couplers and Y-splitters
      • MMIs
      • MZIs
      • Spirals
      • Resonators
      • Filters
      • AWGs
      • Thermo-optic phase shifters
      • Polarization handling components
      • High speed ring modulators (*available soon)
      • High speed Mach-Zehnder modulators (*available soon)

Standard SOI delivery times (for on-demand runs, for MPWs refer to each MPW schedule)

      • Passives: 1.5 month FRO (1 month with rapid cycle premium)
      • Passives – T/O phase shifters: 2.5 months FRO (2 months with rapid cycle premium)

ADVANCED SOI PROCESSES

SiPhotonIC offers the following advanced processes for the SOI platform, which can be requested on-demand:

      • Advanced process I: Deep trench etching for thermal isolation between elements
      • Advanced process II: State-of-the-art “Advanced-coupling SOI” with Aluminum-assisted grating couplers for sub-dB operation, extremely useful for sensitive applications where every dB counts, like quantum photonics. The technology can be used with both single polarization and dual polarization grating couplers. (About the technology)

Advanced SOI delivery times (for on-demand runs)

      • SOI with thermal isolation trenches: 3 months FRO (2.5 months with rapid cycle premium)
      • Advanced coupling SOI (passives / passives with T/O): 2.5-3.5 months FRO (2-3 months with rapid cycle premium)

 

CUSTOM SOI

SiPhotonIC offers fully-customized SOI photonic stacks tailored to your specific R&D requirements.

Whether you need modifications to our standard 220SOI and 250SOI platforms or a completely bespoke SOI stack fabricated, we provide the flexibility to adapt materials, layer structures and process parameters according to your application with maximum design freedom.

Examples from past custom SOI projects (in series):
Si photonic crystal suspension, photonic crystals with SiO2 openings, Si-polymer slot waveguides for high-speed modulation, Si slot meta-surfaces, graphene Si E-O modulator, graphene heaters on Si waveguides, silicon nitride on SOI, Si deep etching, topology-optimized structures).

Custom SOI delivery times (on-demand runs)

      • Contact us for project-specific delivery estimates

EARLY ACCESS SOI

Gain early access to the advanced SOI developments. You can experiment by joining one of our on-going development runs and benefit from accessing cutting edge technology with competitive pricing. Get in contact with us to learn more about our developments.

SOI MULTI-PROJECT WAFER (MPW) RUNS

Join our scheduled SOI Multi-Project Wafer runs that provide an accessible and cost-effective route to prototype your silicon photonic integrated circuits.
The MPW runs are intended for academic, research and industrial R&D applications, particularly for teams looking to validate designs reliably at a significantly lower cost than a dedicated on-demand run.

MPW 220SOI - passive devices with heaters

Our MPW 220SOI runs are currently focused on 220 nm passive silicon photonic devices with integrated heaters, providing a platform for prototyping of any photonic circuit relying on components such as waveguides, splitters, couplers, interferometers, resonators, thermo-optic phase shifters.

MPW type SIPHOTONIC MPW 220SOI (P+H)
Platform 220 nm Silicon-on-Insulator, Passive devices with thermo-optic heaters, C-band operation
SOI technology Si etching depths: 70 nm, 150 nm & 220 nm, BOX thickness: 3 μm, TOX thickness: 1 μm, Heaters: Ti, Wire/pads: Al/Au, Minimum feature size: 200nm, Dicing: saw & stealth dicing
Performance
(TE @1550nm)
Waveguide propagation loss: < 4 dB/cm
Grating couplers loss: 4-6 dB/coupler
Edge couplers loss: 1-2 dB/coupler
Thermo-optic phase shifter (MZI): P2π: 23 mW, V2π: 4.5 V
Customizations Customizations are limited to features compatible with the standard 220SOI platform.
PDK availability xPDK available for Luceda, Synopsys, KLayout, gdsFactory, Nazca, L-Edit, GdsPy and other open-source PDAs.
Additional services provided for the MPW High-resolution surface SEM imaging: 10/15/20 images.
Available upon separate request - subject to additional cost.
Design kit (xPDK, design manual, GDSII templates) Provided with NDA
DRC Currently performed at foundry
Design area options 5mm x 5mm / 5mm x 10mm / 10mm x 10mm
Number of PICs Standard pack = 12 PICs, Extra pack = +12 PICs
Submission, Support, NDA, MPW service agreement Contact info@siphotonic.com

MPW schedule

Year Run ID Registration due date Design due date Expected ship date
2026 MPW 220SOI #1 (P+H) 30.10.2026 30.11.2026 31.03.2027
2027 MPW 220SOI #2 (P+H) 28.02.2027 31.03.2027 30.07.2027

Pricing & quantities

Area Design/PIC format Standard pack
(12 PICs)
Extra pack
(+12 PICs)
Discounted price
(see notes)
25 mm2 5mm x 5mm 12,500 € +2,500 € -5%
50 mm2 5mm x 10mm 17,000 € +2,750 € -5%
100 mm2 10mm x 10mm 30,000 € +3,000 € -5%

*Quoted prices are exclusive of VAT, import duties/customs fees, withholding taxes etc.

How to join our MPWs

1. Select an MPW Run – Choose the appropriate platform, technical specifications, and available MPW call.

2. Sign the NDA – Contact us at info@siphotonic.com to sign a mutual NDA. Signing the NDA does not commit you to participating in the MPW.

3. Receive the Design Kit – You will receive the relevant xPDK libraries, design manual, GDSII templates, and other technical information required for your design.

4. Register for the MPW – Submit your MPW Registration Form & PO to info@siphotonic.com before the registration deadline of each run. At this stage, the following documents must also be completed:

  • MPW Terms & Conditions, in addition and extension to the our General Terms & Conditions. The fully executed agreement must be received before the registration deadline.
  • End-Use Certificate for Dual-Use Items (EU Reg. 2021/821) when PICs are to be exported outside the EU, as required by our export-control policy. (SiPhotonIC reserves the right to decline MPW participation where applicable export requirements are not met.)

5. Prepare & Submit Your Design – Use the relevant PDK, design rules, and templates to prepare & submit your design to info@siphotonic.com. SiPhotonIC will perform a preliminary DRC check, allowing you time for corrections before the final design deadline.

6. Fabrication – Your design is included in the selected MPW run, with periodic progress updates provided throughout the fabrication process.

7. Delivery – Your completed PICs are shipped according to the announced delivery schedule.

Notes

  • The pricing is based on the selected SiPhotonIC MPW offering, design area, and prototyping volume.
  • Discounted pricing is available to academic institutions and research facilities, provided that the fabricated devices are used exclusively for educational purposes or publicly funded research. SiPhotonIC must be appropriately acknowledged in any resulting publications, presentations, or other public dissemination.
  • The customer receives the specified quantity of unpackaged PICs according to the selected offering.
  • PICs are delivered in protective packaging and shipped to the customer as part of the MPW offering.
  • MPW schedules are indicative and subject to change. SiPhotonIC reserves the right to cancel any fabrication run.
  • Due to run logistics, customers may receive additional PICs at no additional cost.
  • All MPW runs are subject to the SiPhotonIC “General Terms & Conditions” www.siphotonic.com and “Terms and Conditions for SiPhotonIC MPW services”