SiPhotonIC is using the state-of-the-art DTU Danchip National Center for Micro- and Nanofabrication (DTU Danchip) and a network of suppliers for all on-demand and MPW runs.
DTU Nanolab occupies 1350 m2 state-of-the-art class 10-100 ISO-9001 certified cleanroom facilities and is equipped with advanced machines for photonic integration, including: a 100kV JOEL JBX-9500FSZ E-Beam Writer, a Canon FPA-3000EX4 DUV Stepper Lithography writer, advanced etchers, deposition and several back end of line tools.
All fabrication tools and process modules can be accessed as a dedicated service for your intermediate nanofabrication process steps, enabling flexible prototyping, process customization, and rapid iteration during device development.
E-beam lithography (EBL)
EBL lithography is a powerful lithographic process that allows users to pattern very small photonic structures with dimensions ranging from sub-micrometer down to a few nanometers.
EBL features:
- High resolution lithography
- Structures with critical dimensions down to ~10 nm (limitations apply)
- Highly accurate & maskless patterning
- High aspect ratio structures
Deep-UV (DUV) lithography
DUV lithography is a well-established lithographic process that allows users to pattern photonic structures of medium resolution requirements with the use of DUV light and a photomask/photoresist.
DUV lithography features:
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Medium & small resolution lithography
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Structures with critical dimensions down to ~200 nm
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Developing multiple chips on wafer scale for volume
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Fast & flexible iteration of the designs on a wafer
Deposition / Etching / Other processes
SiPhotonIC offers several deposition, etching and back-end processes.
Deposition: A large number of materials can be deposited through plasma-enhanced, e-beam evaporation and sputtering techniques. Common semiconductor fabrication thin film deposition processes are also offered.
Etching: Both wet etching and dry etching options are available. A total of 8 plasma assisted (ICP) tools for dry etching and several etch baths for wet chemical etching can be used.
Other processes: dicing (saw dicing, stealth dicing), SEM imaging, in-line characterization (upon request), packaging (upon request)
