SERVICES
SiPhotonIC currently offers the following prototyping pathways.
Refer to the respective factsheets to find more about our main integration capabilities, materials and our prototyping/ordering manual.
E-beam lithography (EBL) nanofabrication
EBL lithography is a powerful lithographic process that allows users to pattern very small photonic structures with dimensions ranging from sub-micrometer down to a few nanometers.
EBL features:
- High resolution lithography
- Structures with critical dimensions down to ~10 nm (limitations apply)
- Highly accurate & maskless patterning
- High aspect ratio structures
Deep-UV (DUV) lithography nanofabrication
DUV lithography is a well-established lithographic process that allows users to pattern photonic structures of medium resolution requirements with the use of DUV light and a photomask/photoresist.
DUV lithography features:
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Medium & small resolution lithography
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Structures with critical dimensions down to ~200 nm
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Developing multiple chips on wafer scale for volume
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Fast & flexible iteration of the designs on a wafer
Deposition / Etching / Other processes
SiPhotonIC can provide several deposition, etching and back-end processes.
Deposition: A large number of materials can be deposited through plasma-enhanced, e-beam evaporation and sputtering techniques. Common semiconductor fabrication thin film deposition processes are also offered.
Etching: Both wet etching and dry etching options are available. A total of 8 plasma assisted (ICP) tools for dry etching and several etch baths for wet chemical etching can be used.
Other processes: dicing (saw dicing, stealth dicing), SEM imaging, in-line characterization (upon request), packaging (upon request)
