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Ebeam lithography based nano-fabrication
News
100kV E-Beam Writer JBX-9500FSZ
Advanced silicon etching machine
SiPhotonIC Technologies is excited to join the Quantum Business Network (QBN)
|QBN〉is an industry consortium for #quantumtechnologies bringing together people from academia, industry and politics and provides its members growth acceleration and technological advancements through industry collaborations and technology and knowledge transfer.
SiPhotonIC Technologies joins the Danish Quantum Community (DQC)
SiPhotonIC Technologies is now a member of EPIC- The European Photonics Industry Consortium.
SiPhotonIC Technologies joins EPIC Association
SiPhotonIC Technologies is now a member of EPIC- The European Photonics Industry Consortium.
Stelios Pitris joins SiPhotonIC as Business Developer.
Dr. Stelios Pitris joined SiPhotonIC as a business developer to expand further the company activities.
Multidimensional quantum entanglement with large-scale integrated optics
The ability to control multidimensional quantum systems is central to the development of advanced quantum technologies. We demonstrate a multidimensional integrated quantum photonic platform able to generate, control, and analyze high-dimensional entanglement.
Demonstration of chip-to-chip quantum teleportation
We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.
Generation and sampling of quantum states of light in a silicon chip
AbstractImplementing large instances of quantum algorithms requires the processing of many quantum information carriers in a hardware platform that supports the integration of different components. Although established semiconductor fabrication processes can integrate...
SiPhotonIC fabricates your designs based on high-precision ebeam lithography (EBL) and advanced silicon etching (ASE) silicon nano-fabrication. Your chip sample(s) are delivered to you with short turn-around time (typ. 2-3 months after design submission). The typical feature size limit of our nano-fabrication is ~40nm for EBL + etching process, 50~100nm for EBL + liftoff process (depending on metal thickness), as shown below. A ~10-20nm minimum feature size can also be resolved for some applications.
Scanning electron microscope image of nano-structures obtained at the limit of our EBL
Scanning electron microscope image of a fabricated plasmonic slot waveguide with 100nm gap and 100nm thick Au layer, coupled by silicon waveguide.
Platforms
We have matured library on silicon-on-insulator with 250nm thick top silicon-layer. We provide nano-fabrication on standard silicon-on-insulator platform and advanced silicon-on-insulator platform with Al mirror. Standard silicon-on-insulator platform can be used for optical communication, such as microwave photonics, while advanced silicon-on-insulator platform can be used for on-chip quantum photonics where coupling loss is critical. Typical specifications are shown as follows.
Standard SOI platform
| Typical components | Performances |
| Grating coupler | coupling loss: <3.5 dB |
| Strip waveguide | Propagation loss: <2.5dB/cm |
| Mach–Zehnder interferometer | Insertion loss: <0.1dB |
| Cross intersection | Insertion loss:~0.1dB/cross Crosstalk: <-40dB |
| Thermal tunable phase shifter | Tunability: > 2π |
Advanced SOI platform
| Typical components | Performances |
| Grating coupler | coupling loss: <1.2 dB |
| Strip waveguide | Propagation loss: <2.5dB/cm |
| Mach–Zehnder interferometer | Insertion loss: <0.1dB |
| Cross intersection | Insertion loss:~0.1dB/cross Crosstalk: <-40dB |
| Thermal tunable phase shifter | Tunability: > 2π |
| Typical components | Performances |
| Grating coupler | coupling loss: <3.5 dB |
| Strip waveguide | Propagation loss: <2.5dB/cm |
| Mach–Zehnder interferometer | Insertion loss: <0.1dB |
| Cross intersection | Insertion loss:~0.1dB/cross Crosstalk: <-40dB |
| Thermal tunable phase shifter | Tunability: > 2π |
| Typical components | Performances |
| Grating coupler | coupling loss: <1.2 dB |
| Strip waveguide | Propagation loss: <2.5dB/cm |
| Mach–Zehnder interferometer | Insertion loss: <0.1dB |
| Cross intersection | Insertion loss:~0.1dB/cross Crosstalk: <-40dB |
| Thermal tunable phase shifter | Tunability: > 2π |
Design flexibility
SiPhotonIC offers numerous verified building blocks for your designs. Our complete Process Design Kit (PDK) is available in Synopsys.
News
SiPhotonIC Technologies is excited to join the Quantum Business Network (QBN)
|QBN〉is an industry consortium for #quantumtechnologies bringing together people from academia, industry and politics and provides its members growth acceleration and technological advancements through industry collaborations and technology and knowledge transfer.
SiPhotonIC Technologies joins the Danish Quantum Community (DQC)
SiPhotonIC Technologies is now a member of EPIC- The European Photonics Industry Consortium.
SiPhotonIC Technologies joins EPIC Association
SiPhotonIC Technologies is now a member of EPIC- The European Photonics Industry Consortium.
Stelios Pitris joins SiPhotonIC as Business Developer.
Dr. Stelios Pitris joined SiPhotonIC as a business developer to expand further the company activities.
Multidimensional quantum entanglement with large-scale integrated optics
The ability to control multidimensional quantum systems is central to the development of advanced quantum technologies. We demonstrate a multidimensional integrated quantum photonic platform able to generate, control, and analyze high-dimensional entanglement.
Demonstration of chip-to-chip quantum teleportation
We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.
Generation and sampling of quantum states of light in a silicon chip
AbstractImplementing large instances of quantum algorithms requires the processing of many quantum information carriers in a hardware platform that supports the integration of different components. Although established semiconductor fabrication processes can integrate...